Nordson ASYMTEK

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International Wafer-Level Packaging Conference 2017

San Jose, CA 95110

24 Oct 2017 - 26 Oct 2017

Come hear Mr. Akira Morita of Nordson ASYMTEK present the Underfill Dispensing for Chip-on-Wafer paper at the 14th IWLPC

Conference: October 24-25, 2017
Exhibition: October 24-25,2017
Workshops: October 26,2017

Doubletree by Hilton
2050 Gateway Place
San Jose, CA 95110

IWLPC Presentation Schedule

For more information on the conference please visit IWLPC

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