Nordson DIMA

Corporate | Global Directory | Languages


Defense

Defense IndustryIn the Defense – or Military – Industry, many governmental and commercial organizations work together in production and service facilities, and demanding research and development projects.  Nordson DIMA’s equipment is very suitable to assist in these kind of arduous applications that require stable processes and quality process controls, repeatability and reliability.

Typical applications are: 

  • Aircraft construction
  • Automotive construction
  • Defense weaponry
  • Electronic systems and components.  

Processes


 
  • Sort Order:

C-Quence - Automated in-line solution system

C-Quence - Automated in-line solution system With C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.  

C-Drive Head

C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give…

C-Flow Controller with touchscreen

C-Flow Controller with touchscreen The C-Flow Controller stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring and force control,…


C-Base with touchscreen

C-Base with touchscreen The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control…

C-Prime with touchscreen

C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm.

C-Slide with touchscreen

C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with…


C-Turn with touchscreen

C-Turn with touchscreen C-Turn Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up…

C-TurnFlux

C-TurnFlux The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality…

C-Tack with touchscreen

C-Tack with touchscreen C-Tack Desktop System for ACF Laminating, also called Pre-Tacking or Pre-Bonding. 


Search Again

Refine Search:
Processes

View All




Applications

View All




Divisions