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Are You Getting to the Bottom of Your Via?

New VIA™ Series 2.5 cleans deep, narrow vias where other processes can’t go!

Nordson MARCH VIA SeriesPCB panels are becoming thicker, via trenches deeper, and via openings smaller. Simply, the aspect ratio between via opening and depth is becoming more difficult to clean, treat, and etch. To meet the challenges of these difficult PCB applications, March worked collaboratively with some of our key customers to develop VIA series 2.5.

This is not a new generation, but an evolution of the current VIA 2.0 series. The most noticeable update is the chamber interior, which only consists of electrodes. All of the RF bussing has been removed and externally connected via the water channels. Individual electrode gas feeds were replaced with a shower head at the top of the chamber. Door reinforcements were moved to the outside of the door. The sum of these changes has resulted in a smooth and fluid assembly, enabling better flow dynamics.

Specific to performance, VIA series 2.5 has shown to perform at least 20% better, weight-loss and microsection, than the current VIA generation. For high-aspect ratio boards, it can process panels untreatable by the current VIA generation. 

At Nordson MARCH, we believe performance improvements are more than just new plasma platforms. These improvements have to benefit current customers, allowing systems to be upgraded to meet the most challenging applications.

 

Nordson MARCH VIA 2.5 Series Plasma Treatment Systems

 

 

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