Nordson SELECT

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Nordson SELECT to Exhibit Award Winning Selective Soldering Technology at NEPCON South China 2018 Exhibition

21 Aug 2018

Integra™ 508.2 features unique parallel and double processing modes expanding selective soldering throughput and flexibility

Liberty Lake, WA, USA – 21 August 2018 – Nordson SELECT, a Nordson company (NASDAQ: NDSN), will  exhibit its award-winning selective soldering technologies in Booth 1H20 at the upcoming NEPCON  South China 2018 exhibition scheduled to take place August 28-30, 2018 at the Shenzhen Convention and Exhibition Center in Shenzhen, China.

On exhibit will be an Integra™ 508.2 selective soldering system equipped with advanced process controls. The Integra™ 508.2 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing.  When configured with dual drop-jet fluxers and dual solder pots, the Integra™ 508.2 can solder two boards at the same time in each soldering station. When operated in the parallel mode, the Integra™ 508.2 can process up to four boards at one time significantly increasing machine productivity.

Also on display in Booth 1H20 at the Shenzhen Convention and Exhibition Center will be a full range of innovative products from Nordson’s Advanced Technology Systems including Nordson ASYMTEK, Nordson DAGE, Nordson MARCH, Nordson MATRIX, Nordson SONOSCAN and Nordson YESTECH.  This full range of Nordson’s Advanced Technology Systems products includes dispensing and conformal coating systems, X-ray inspection and bondtesting, plasma treatment systems, acoustic microscopy, and automated optical inspection systems.

For information contact Nordson SELECT at sales.usa@nordsonselect.com, call +1.509.924.4898, or visit our website www.nordsonselect.com.

About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo™ standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno™ in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra™ multi-station modular systems designed to meet themost challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput. To find out more, visit www.nordsonSELECT.com, or on social media.

About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries. Visit Nordson on the web at http://www.nordson.com, @Nordson_Corp, or www.facebook.com/nordson.

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For information:
Nordson SELECT: Bob Klenke
Marketing Coordinator
Tel: +1.509.924.4898
Email: bob.klenke@nordsonselect.com

International Offices:
Headquarters, Liberty Lake, WA: +1.509.924.4898 www.nordsonselect.com
China: +86.21.3866.9166
Europe: +31.43.352.4466
India: +91.44.4353.9024
Japan: +81.3.3599.5920
Korea: +82.31.765.8337
Southeast Asia: +65.6796.9515
Taiwan: +886.2.2902.1860

 






























About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo™ 
standalone machines offering exceptional value and superior process capability ideal for batch 
production, Cerno™ in-line systems delivering uncompromised quality and productivity for demanding 
soldering applications, and Integra™ multi-station modular systems designed to meet the most
challenging high-volume requirements by combining parallel processing with multiple soldering 
nozzles
 

 

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