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Nordson YESTECH to Debuts FX-500 Ultra 3D Solder Paste Inspection Solution at APEX 2018

27 Mar 2018

Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, debuted their new FX-500 Ultra 3D Solder Paste Inspection system at this year’s APEX show, held at the San Diego Convention Center, in San Diego, California on February 26th to March 1st.

 

Nordson YESTECH’s FX-500 ULTRA 3D SPI provides 3-D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability. The new special warp compensation algorithm allows high speed compensation for warp on complex shapes contained within a field of view.

 

The ultrafast 3D sensor combines with a unique 'all-in- one' scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence - making the FX-500 ULTRA 3D SPI one of the fastest systems in the market. The use of high speed “on the fly” inspection allows to minimize vibrations effects delivering greater accuracy and best in class repeatability.

 

The FX-500 SPI saves valuable inspection time, delivering a complete, high-speed inspection solution of solder paste area coverage, volume, registration and bridge detection featuring:

  • High Accuracy at Fastest Speed
  • Full "on the fly" 3D solder paste metrology
  • Feedback, Feed Forward Ready (I 4.0)
  • Proprietary strobe lighting
  • Built in barcode reading for traceability
  • Intuitive software with touch screen programming

 

With automated defect review, plus SP, barcode reading and archiving of board image and inspection results, the FX-500 SPI provides the very best in 3D solder paste inspection.

“The FX-500 Ultra 3D SPI is a valuable asset to any organization’s quality control procedure,” said Don Miller, Nordson YESTECH Vice President. “The APEX show is a great platform to debut the new system, as well as show our latest technology advancements. We are very excited to offer this powerful new SPI inspection tool to our valued customers and look
forward to discussing the many benefits it provides.”

Editor's Note
High-resolution images of Nordson YESTECH’s product line are available by calling us at: 760-918-8471 or visit http://www.nordsonyestech.com For pricing and availability call Nordson YESTECH's USA HQ at: 760-918-8471 or visit the Nordson YESTECH website at http://www.nordsonyestech.com

About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly  and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit www.nordsonyestech.com.

About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatingspolymerssealantsbiomaterials, and other fluidsto test and inspect for quality, and to treat and cure surfaces.  These products are supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.  Visit Nordson on the web at www.nordson.comwww.twitter.com/Nordson_Corp or www.facebook.com/nordson.