Acoustic microscopes for both Laboratory and Production Floor environments.

Acoustic microscopes for both Laboratory and Production Floor environments.

Welcome to AMI

Leaders in C-SAM tools for non-destructive internal inspection and analysis.


Nordson TEST & INSPECTION is the most trusted authority on the application of Acoustic Microscopy, also known as Acoustic Micro Imaging (AMI) technology for nondestructive internal inspection and analysis.

Nordson TEST & INSPECTION's C-SAM acoustic microscopes are recognized as the benchmark for accuracy.  You’ll benefit from the unmatched expertise of our dedicated acoustic applications engineers. Our engineers represent the leading minds in AMI and regularly receive industry recognition and awards, including the prestigious IEEE Rayleigh Award.


Our Products
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Embrace the Future of Wafer Inspection


Introducing SpinSAM as a game changer in the fast-paced world of semiconductor manufacturing. With extremly high throughput, precision and efficiency without sacrificing accuracy. SpinSAM is scanning four wafers simultanousely. The system has a innovative spin scan method including its proprietary transducer technology.

 

SpinSAM

Nordson TEST & INSPECTION AMI Products


Laboratory AMI Inspection Systems


The most popular, sophisticated and fully featured C-SAM acoustic microscopes used worldwide for routine laboratory analysis and specialized high resolution applications for component screening.

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Production AMI Inspection Systems


These fully featured C-SAM acoustic microscopes used worldwide for accelerated throughput as well as semi-automated screening of microelectronic devices on the manufacturing floor.

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Applications


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Microelectronics


Hidden defects such as delaminations, cracks and voids within a microelectronic application can lead to catastrophic failure of the device. Nordson TEST & INSPECTION's Acoustic Micro Imaging has always been the most trusted technology for nondestructive inspection of microelectronics.
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Power & Energy


Consistency and precision in the thermal interface can be the difference between exceptional performance and early failure. Nordson TEST & INSPECTION's C-SAM® acoustic microscopes can precisely measure material thickness and bonding consistency in a solar application, detecting voids, delaminations and imperfections in bond materials before problems occur.
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  • Automotive
  • Military & Aerospace
  • MEMS, Wafers & Seals
  • Materials & Composites
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When a circuit is being used in an aerospace, military or automotive application, a component failure can be a matter of life and death. Nordson Test & Inspection has extensive experience with nondestructive testing for MIL-SPEC and High-Rel devices.
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Delaminations and voids can compromise the hermiticity of MEMS devices. Nordson Test & Inspection's C-SAM® acoustic microscope technology delivers the next generation of innovation for MEMS inspection, finding the defects that hermetic testing just can't detect.
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Invisible defects such as surface cracks, voids, delaminations and internal porosity flaws can ruin the performance of a component. Nordson Test & Inspection's Acoustic Micro Imaging (AMI) techniques detect these material-weakening flaws better than any other inspection method. Sonoscan systems nondestructively inspect materials layer by layer, delivering accurate and comprehensive analysis for product development, failure analysis and process control insights.