Inline and Lab Based X-ray Inspection and Metrology Solution
Nordson Test & Inspection offers a comprehensive range of inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality.
Check shape, fill level and voiding in TSV through silicon vias.
Inspect build quality, wire bonds, component alignment and solder & adhesive voiding during MEMS manufacture.
Check for bump presence, shape, position and voiding in wafer bumps.
Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages.
Nordson Test & Inspection AXM Products
XM8000-7P
The Nordson XM8000-7P is specifically designed for X-ray inspection of panel level packages with maximum panel size of 510mm x 515mm.
Enabling manufacturers to identify even the smallest defects, buried inside multi-layer semiconductor panel level packages. The 7-axis system includes a detector gimbal for 3D capabilities which is the pinnacle of accuracy for fully-automated X-ray metrology.
XM8000 Series
Enabling manufacturers to identify even the smallest defects, buried inside multi-layer semiconductor panel level packages. The 7-axis system includes a detector gimbal for 3D capabilities which is the pinnacle of accuracy for fully-automated X-ray metrology.
XM8000-7 Pro
Designed for the most demanding advanced packaging applications, Nordson XM8000-7 Pro sets a new benchmark in high performance 3D metrology. Engineered for exceptional repeatability and accuracy, the XM8000 Pro delivers sub micron level 3D reconstruction with unmatched imaging fidelity and throughput.
XM8000-5
Nordson XM8000-5 is the fastest X-ray metrology system on the market, integrated with a large field-of-view (FOV) Aspire™ XL detector. It is optimized for high throughput and high accuracy inspection making it vital for highly populated semiconductor wafers.
XM8000-5 Datasheet