Fully Automated Bondtesters
What's NEW ?
The 4800 INTEGRA Plus is the next generation automated bond test solution designed to meet the dynamic wafer-level packing environment. With its new motion, vision, and wafer handling system complemented by the high-throughput Paragon software, the system offers best-in-class micro bump and trace bond testing on chip-on-wafer, stacked wafer, and molded wafer applications. The system demonstrates unmatched precision, hands-free, and fully traceable bond testing capability for both 200 and 300mm wafers enabled by a smart load port and wafer chuck, and Matrix Map software.
Ready for the next step of automation using Nordson Intelligence for easy Autograding routines.
New Product: BT 4000 HS Shear
Taking the next level for High Speed Bondtesting
The 4000HS Shear proudly maintains Nordson excellence in repeatable, reliability and most importantly the accuracy of measurement data, which are powered by carefully engineered motion system and patented high speed transducer technology. Since its first introduction, 4000HS Shear has provided every customer with quality assurance, dependable performance and savings from ever more expensive drop testing.
Nordson Test & Inspection Test Products
Stellar 4000
4000 Plus
4800 INTEGRA
Accessories
Paragon Lite Software
Paragon Test Software