HBM Reliability with 3D X-ray Inspection

Developing more robust, high-performance components - this must be the goal at a time when it is essential to use resources cautiously.
Using advanced 3D X-ray inspection methods like Micro CT and X-Plane Pro brings us closer to the destination.
There are e.g. High Bandwidth Memory (HBM). This is currently revolutionizing AI, high performance computing, and advanced graphics systems.

Its 3D architecture - stacked DRAM dies interconnected via Through-Silicon Vias (TSVs) - delivers exceptional bandwidth and efficiency.
But this complexity introduces new challenges for inspection and quality assurance. HBM inspection needs a non-destructive, volumetric view,
enabling engineers to detect defects that could compromise performance or reliability.